The P2S is the 2025 successor to the P1S, priced $150 less while upgrading the max speed to 600mm/s and bed temperature to 120°C. It’s now the primary enclosed Bambu recommendation for users who don’t need X1C’s LiDAR or H2D’s active chamber heating. The functional difference from the P1S is minor in practice — the bed temperature increase matters most for PC and high-temp nylon bed adhesion; the speed increase is real but secondary to print quality for most materials.
What It Does Well
120°C bed temperature is a meaningful upgrade from the P1S’s 110°C. PC (polycarbonate) adhesion to PEI requires 110–120°C — the P2S is now in the right range without fighting against an undersized bed temp. PA-CF also benefits from the higher initial bed temperature for first layer adhesion.
The passive enclosure reaches 40–50°C chamber during ABS and ASA prints, which is adequate for most enclosed-material work. Same behavior as the P1S — the P2S doesn’t add active heating, just the higher max temperature spec and refined motion system.
600mm/s with Bambu’s input shaping delivers noticeably faster PLA and PETG jobs compared to the P1S. For high-volume printing where time matters, this is real. For single complex prints, the practical time difference is smaller.
AMS compatible (up to 16 colors). Bambu Studio’s multicolor workflow is mature and handles most edge cases automatically.
Where It Falls Short
Same passive enclosure limitation as the P1S. Tall ABS parts (200mm+) can show temperature consistency issues during the early warm-up phase. Very tall parts in warp-prone materials still benefit from an extended warm-up period before the part gets tall.
300°C nozzle cap. Adequate for most engineering materials but not for PEEK, PEI, or high-Tm technical polymers. For true high-temperature work, the H2D or a dedicated high-temp machine is necessary.
The P2S is new — long-term reliability data is still accumulating. The P1S had an extended track record; users who prioritize a proven machine may prefer to wait.
Materials
ABS and ASA: 240–250°C nozzle, 100–110°C bed, zero fan. The passive enclosure works well for parts under 200mm. Taller parts should run at slower speeds (80–100mm/s) to give the chamber time to maintain temperature.
PC (Polycarbonate): 270–280°C nozzle, 115–120°C bed (critical — lower temps cause first layer adhesion failure). Zero fan. Passive enclosure reaches adequate temperature for PC under 150mm tall.
PA-CF: Hardened nozzle required (install before first print). 260–270°C, 95°C bed. Dry filament 8–12h at 80°C. The 120°C bed is helpful for PA-CF first layer adhesion on glass/Garolite.
PETG: 240–245°C, 70–75°C bed, 40% fan. PETG works well in the enclosure — the enclosed environment reduces drafts that cause surface inconsistencies.
PLA/PLA+: Works well but the enclosure is unnecessary overhead. If PLA is the primary material, the A1 ($399) saves $150.
vs. the Competition
Bambu P1S ($699): Predecessor, slower (500mm/s), lower bed temp (110°C), now more expensive. Buy P2S over P1S unless the P1S is significantly discounted.
Bambu X1C ($1,449): Adds LiDAR, AI failure detection, 320°C nozzle. For the use cases the P2S handles well, those features are conveniences. The $900 premium is hard to justify unless LiDAR inspection or 320°C materials are required.
QIDI Q1 Pro ($449): More affordable enclosed option, 350°C nozzle, active chamber heating. Trade-off is smaller build volume (245mm) and Bambu ecosystem maturity vs. QIDI’s raw hardware specs.